Capacity: 10CC

Model: NC-559-ASM

Color: As shown

Suitable for BGA ball, semiconductor packaging, repair.

Computer motherboard north and south bridge, communications,

graphics and other BGA apply.

Features:

1: This product is no-clean flux very little residue, without washing.

2: The residue is colorless and transparent appearance outstanding.

3: Excellent printing performance with suitable hand and machine print.

Is currently the best on the market BGA, CSP rework help paste.

Just apply a little each time

When the bumping of the BGA chip coated with flux and PCB pads are required coat,

Good BGA soldering flux and machine regardless of manual

the success rate is greatly increased.

Package Included:

According to your choice as shown